The utility model relates to a plastic elastic pad for packaging a semiconductor wafer. More specifically, it relates to a plastic stretch pad having at least one elastic structure that allows external pressure to be buffered inwardly from both sides of the surface. The plastic elastic pad includes a first contact surface (42) and a second contact surface (44). At least one elastic plastic portion (46) is included between the two contact surfaces (42, 44). The elastic plastic portion (46) can provide the required elastic cushioning so that the elastic pad functions under the action of an external force. The design of elastic plastic ensures that the elastic pad will not be deformed laterally under external force.
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